Polyamide adhesives siam dan tur

Dimeric Linoleic Acid siam dan: Linoleic acid, leilung, lithium carbonate leh tui te chu reactor-ah dahin pressure 0.8–1.2 MPa-ah stir a ni. Temperature chu 230 degree-ah tihsan a ni a, darkar 5 chhung an inrem a ni. Chumi hnuah chuan 100℃-ah a lum a, phosphoric acid aqueous solution 1.92 g a dah a. Chumi hnuah pressure chu 0.3–0.5 MPa-ah tihhniam a ni a, darkar 1 chhung chu 150 degree-ah tihsan a ni. A tawpah chuan temperature chu 100℃-ah tihhniam a ni a, a lum laiin filter-in catalyst chu a paih chhuak ta a ni. Chumi hnuah unpolymerized unsaturated fatty acids chu vacuum sang tak (6.7–10.7 Pa) hnuaiah 220–225 degree-ah an vawt a, high-purity dimerized linoleic acid an hmu ta a ni.

Polyamide Hot Melt Adhesive siam dan: Nitrogen venhimna hnuaiah ethylenediamine leh hexamethylenediamine inzawmkhawm chu zawi zawiin a hrual a, 130℃thlenga tihlum a ni. Hetih lai hian temperature chu 140–150℃ah control a ni. Addition zawh hnuah temperature chu 205–220 degree-ah tihsan a ni a, product-a tui awm zat chuan theoretical value a hnaih thlengin reaction chu a chhunzawm zel a ni. Tichuan, pressure chu tihhniam a ni a, darkar khat dang 1.3–2.7 kPa leh 220–230℃-ah reaction chu chhunzawm leh a ni. A tawpah chuan sample lak a ni a, amine value chu hriat theih a ni. Index (10 vel) a tlin chuan product chu a lum thei a, a discharge thei bawk. Hot melt adhesive hi a softening point hi dilinoleic acid, sebacic acid, ethylenediamine, leh hexamethylenediamine hman zat a zirin a inang lo.