Polyamide Adhesives chungchang hriat hmasakna

Epoxy-polyamide adhesives, epoxy resins hmanga siam hian fatty acid carbon chain sei tak a nei a, chu chuan tough yet non-brittle cured product a siam a ni. Mixing requirement khauh lo zawk an nei a, pot dam rei tak an nei a, hman pawh an awlsam hle. Adhesion chak tak an lantir a, metal leh non-metal tam zawkte nena bonding performance tha tak an lantir a ni. Cured product hian shrinkage a nei tlem (low or even non-toxic) a nei a, hei vang hian environment friendly adhesive a ni. Heating hian curing a ti chak thei a, bond strength a ti sang thei bawk; 120 degree-a minute 30 chhung curing chu room temperature-a ni 7 chhung a ni. Mahse, a heat resistance hi a hniam hle a, a hnathawhna temperature sang ber chu 60℃a ni.

Low-molecular-weight polyamide curing agents hi thil thar siam chhuah zel a ni a, chi hrang hrang low-viscosity, transparent, fast-curing, high-adhesion, leh water-based types te pawh a awm. Ṭhenkhat chuan epoxy adhesives tan chuan peel strength 10 kN/m aia tam an nei thei a, hei hi aliphatic amine curing agents pangngai aiin a let nga aia tam a ni.

Epoxy-low molecular weight polyamide adhesives hian toughness tha tak nei mahse, toughening agents nei lo system te bond strength hi a sang lo. Entirnan: E-51 epoxy resin hmun 100 (a rih zawng), polyamide 651 hmun 50, light calcium carbonate hmun 50, DMP-30 hmun 2, leh KH-550 hmun 1. 80℃ah darkar 3 chhung curing. Bonded steel-a room temperature-a shear strength chu 18.2 MPa a ni.