A rilru a buai em em a, a rilru a hah em em bawk a

High-melting-point polyamide hot-melt adhesive hi hot-melt adhesive a ni a, a component ber chu polyamide resin a ni. Melting temperature 140–150℃a nei a, pheikhawk siamna kawngah te, savun folding, cold pressing, leh molding-ah te hman a ni ber. A siamnaah hian dimer linoleic acid, sebacic acid, ethylenediamine, leh hexamethylenediamine te chu raw material atan hman a ni a, nitrogen venhimna hnuaia high-temperature polycondensation reaction hmanga polyamide resin siam a ni. Hemi kawngah hian staged heating, depressurization, leh amine value testing te a tel a ni.

He adhesive softening point hi raw material ratio siamrem hmangin tihdanglam theih a ni a, temperature range 140–200 degree-a processing atan a tha hle. High{3}}temperature stability tihchangtlun nan pyrazole-based anti-aging agent (1-phenyl-3-pyrazole ang chi) 1% chu adhesive solution-ah hian dah a ni tlangpui a, 260 degree-ah pawh stable performance a tichiang a ni.