Electronic Hot Melt Glue Stick hmanga siam a ni
Model TH-703, Electronic Hot Melt Glue Stick hi adhesive thianghlim-white a ni a, PCB, wire tack leh housing te chu second tlemte chhungin a secure a, chutih rualin dust- leh splash-proof seal a siam bawk. A 110℃softening point chu 75℃thlenga thawk appliances chhungah a rigid reng a, chuvangin transformer heat emaw motor vibration hnuaiah bonds te chu a creep lo ang. Hydrogenated resins leh food-grade EVA hmanga siam, ultra-low-VOC formula hian factory-te chu REACH, RoHS leh indoor-air audit-ah extra ventilation awm lovin an pass thei a ni.
Hrilhfiahna
Thil pawimawh tak tak
Electronic Hot Melt Glue Stick hi white-goods, power-tool, LED-driver leh small-appliance siamtute tan bik siam a ni a, chu chu rang tak, thianghlim taka assembly mamawhna leh hun rei tak chhung boruak humhalhna nena inzawm a ni. Adhesive hi 11 mm glue gun emaw micro-dispensing head hmangin 150-170 degree-ah awlsam takin a extrude a, ABS, PC, PP, aluminum leh copper te chu corrosion emaw bloom emaw awm lovin a hnim a ni. Second 3-6 chhungin bond chu a lum a, a tough, white, non-yellowing thermoplastic ah a awm a, chu chuan ABS/ABS joint ah 3.5 MPa shear strength a pe a, 70℃/85 % RH ah 1000 h a paltlang a, weight loss emaw cracking emaw a awm lo.
A chiang taka tuned 110℃Ring-&-Ball softening point chuan normal appliance self{3}}heating laiin polymer chu solid takin a vawng reng a, chutih rualin low-temperature application a phalsak a, chu chuan heat-sensitive components SMD capacitors leh thin-wall plastics te chu a humhim thei a ni. Set a nih chuan adhesive hian water-blocking film chhunzawm zel a siam a, chu chuan enclosure seams, cord entry leh potting-free PCB edges-ah dust-sealing a ti thei a, silicone gasket emaw two{11}}part epoxyes emaw mamawhna a titawp a ni. Hydrogenated tackifying resins hian unsaturated double bonds a paih chhuak a, VOC emission 50 μg g−1 (EU ISO 16000-6) hnuai lam a pe a, 50 mm distance-ah pawh odor level hriat theih loh a siam a, hei hian production line-te chu LEED, WELL leh BSCI indoor-air standards zawm turin a pui a ni.
He formulation hi halogen, antimony, heavy metals, phthalates leh formaldehyde 100 % a awm lo a, RoHS 2.0, REACH SVHC 240 zawm a ni a, resistivity test-ah chuan 3.8 × 1015 Ω cm volume resistivity leh 520 V/mil dielectric strength a awm a, hei hian cured adhesive chu 230 V circuit vel leh LED solder hmanga siam a ni points a ni. He hot-melt stick hian parts a tack rang a, moisture leh dust lakah a seal a, appliance operating temperature a dam khawchhuak a, work floor pawh green takin a vawng reng a, Electronic Hot Melt Glue Stick hian ready-to-use, cost{11}}saving solution a pe a, compliance audit apiang a paltlang thin.
Product Specification chungchang hriat tur
|
MODEL NUMBER a ni |
TH-703 ah a awm |
CHHINCHHIAH |
Tianze a ni |
|
SIAM |
Tiang |
LENZAWNG TEHNA |
11.2*300mm a ni |
|
RAWNG |
Var |
THIL AWMZIA THIL AWMTE |
EVA a ni |
|
SOFTENING POINT THIL AWM DAN |
105-115 inkar a ni |
THIL AWM DAN @170degree |
Sang |
|
OPEN TIME tih hi a ni |
Hmanrua |
SETTING TIME THIL AWM DAN |
Chak |
|
PACKING tih a ni |
20kg/box a ni |
ENCHHINNA |
Free sample a awm bawk |
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